Global Fan-in Wafer Level Packaging Market Size, Status, Research and Forecast 2019-2025

Published On: Jul 2019

Format: PDF

Publisher: QY Research

Pages: 104

Report ID: 2141

Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them.
The analog and mixed IC segment accounted for the major shares and dominated the market. The demand for analog ICs from different segments such as consumer electronics, communications, and automotive and the increasing adoption of smartphones, phablets, and tablets, will fuel the growth of the market segment in the coming years. Additionally, technological advancements in the semiconductor industry that demand the need to ensure the robust performance of advanced ICs will also drive the demand for fan-in WLP packaging.
In terms of geographical regions, APAC will be the major revenue contributor to the market throughout the next few years. This is mainly due to the presence of a number of semiconductor foundries in this region. Moreover, the rise in demand for semiconductor devices due to the presence of prominent consumer electronics manufacturers, such as Samsung, Sony, LG, Toshiba, and Panasonic, will also bolster this market’s growth prospects.
In 2018, the global Fan-in Wafer Level Packaging market size was xx million US$ and it is expected to reach xx million US$ by the end of 2025, with a CAGR of xx% during 2019-2025.

This report focuses on the global Fan-in Wafer Level Packaging status, future forecast, growth opportunity, key market and key players. The study objectives are to present the Fan-in Wafer Level Packaging development in United States, Europe and China.

The key players covered in this study
STATS ChipPAC
STMicroelectronics
TSMC
Texas Instruments
Rudolph Technologies
SEMES
SUSS MicroTec
Ultratech
FlipChip International

Market segment by Type, the product can be split into
200mm Wafer Level Packaging
300mm Wafer Level Packaging
Other

Market segment by Application, split into
CMOS Image Sensor
Wireless Connectivity
Logic and Memory IC
MEMS and Sensor
Analog and Mixed IC
Other

Market segment by Regions/Countries, this report covers
United States
Europe
China
Japan
Southeast Asia
India
Central & South America

The study objectives of this report are:
To analyze global Fan-in Wafer Level Packaging status, future forecast, growth opportunity, key market and key players.
To present the Fan-in Wafer Level Packaging development in United States, Europe and China.
To strategically profile the key players and comprehensively analyze their development plan and strategies.
To define, describe and forecast the market by product type, market and key regions.

In this study, the years considered to estimate the market size of Fan-in Wafer Level Packaging are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

Table of Contents

1 Report Overview
1.1 Study Scope
1.2 Key Market Segments
1.3 Players Covered
1.4 Market Analysis by Type
1.4.1 Global Fan-in Wafer Level Packaging Market Size Growth Rate by Type (2014-2025)
1.4.2 200mm Wafer Level Packaging
1.4.3 300mm Wafer Level Packaging
1.4.4 Other
1.5 Market by Application
1.5.1 Global Fan-in Wafer Level Packaging Market Share by Application (2014-2025)
1.5.2 CMOS Image Sensor
1.5.3 Wireless Connectivity
1.5.4 Logic and Memory IC
1.5.5 MEMS and Sensor
1.5.6 Analog and Mixed IC
1.5.7 Other
1.6 Study Objectives
1.7 Years Considered

2 Global Growth Trends
2.1 Fan-in Wafer Level Packaging Market Size
2.2 Fan-in Wafer Level Packaging Growth Trends by Regions
2.2.1 Fan-in Wafer Level Packaging Market Size by Regions (2014-2025)
2.2.2 Fan-in Wafer Level Packaging Market Share by Regions (2014-2019)
2.3 Industry Trends
2.3.1 Market Top Trends
2.3.2 Market Drivers
2.3.3 Market Opportunities

3 Market Share by Key Players
3.1 Fan-in Wafer Level Packaging Market Size by Manufacturers
3.1.1 Global Fan-in Wafer Level Packaging Revenue by Manufacturers (2014-2019)
3.1.2 Global Fan-in Wafer Level Packaging Revenue Market Share by Manufacturers (2014-2019)
3.1.3 Global Fan-in Wafer Level Packaging Market Concentration Ratio (CR5 and HHI)
3.2 Fan-in Wafer Level Packaging Key Players Head office and Area Served
3.3 Key Players Fan-in Wafer Level Packaging Product/Solution/Service
3.4 Date of Enter into Fan-in Wafer Level Packaging Market
3.5 Mergers & Acquisitions, Expansion Plans

4 Breakdown Data by Type and Application
4.1 Global Fan-in Wafer Level Packaging Market Size by Type (2014-2019)
4.2 Global Fan-in Wafer Level Packaging Market Size by Application (2014-2019)

5 United States
5.1 United States Fan-in Wafer Level Packaging Market Size (2014-2019)
5.2 Fan-in Wafer Level Packaging Key Players in United States
5.3 United States Fan-in Wafer Level Packaging Market Size by Type
5.4 United States Fan-in Wafer Level Packaging Market Size by Application

6 Europe
6.1 Europe Fan-in Wafer Level Packaging Market Size (2014-2019)
6.2 Fan-in Wafer Level Packaging Key Players in Europe
6.3 Europe Fan-in Wafer Level Packaging Market Size by Type
6.4 Europe Fan-in Wafer Level Packaging Market Size by Application

7 China
7.1 China Fan-in Wafer Level Packaging Market Size (2014-2019)
7.2 Fan-in Wafer Level Packaging Key Players in China
7.3 China Fan-in Wafer Level Packaging Market Size by Type
7.4 China Fan-in Wafer Level Packaging Market Size by Application

8 Japan
8.1 Japan Fan-in Wafer Level Packaging Market Size (2014-2019)
8.2 Fan-in Wafer Level Packaging Key Players in Japan
8.3 Japan Fan-in Wafer Level Packaging Market Size by Type
8.4 Japan Fan-in Wafer Level Packaging Market Size by Application

9 Southeast Asia
9.1 Southeast Asia Fan-in Wafer Level Packaging Market Size (2014-2019)
9.2 Fan-in Wafer Level Packaging Key Players in Southeast Asia
9.3 Southeast Asia Fan-in Wafer Level Packaging Market Size by Type
9.4 Southeast Asia Fan-in Wafer Level Packaging Market Size by Application

10 India
10.1 India Fan-in Wafer Level Packaging Market Size (2014-2019)
10.2 Fan-in Wafer Level Packaging Key Players in India
10.3 India Fan-in Wafer Level Packaging Market Size by Type
10.4 India Fan-in Wafer Level Packaging Market Size by Application

11 Central & South America
11.1 Central & South America Fan-in Wafer Level Packaging Market Size (2014-2019)
11.2 Fan-in Wafer Level Packaging Key Players in Central & South America
11.3 Central & South America Fan-in Wafer Level Packaging Market Size by Type
11.4 Central & South America Fan-in Wafer Level Packaging Market Size by Application

12 International Players Profiles
12.1 STATS ChipPAC
12.1.1 STATS ChipPAC Company Details
12.1.2 Company Description and Business Overview
12.1.3 Fan-in Wafer Level Packaging Introduction
12.1.4 STATS ChipPAC Revenue in Fan-in Wafer Level Packaging Business (2014-2019)
12.1.5 STATS ChipPAC Recent Development
12.2 STMicroelectronics
12.2.1 STMicroelectronics Company Details
12.2.2 Company Description and Business Overview
12.2.3 Fan-in Wafer Level Packaging Introduction
12.2.4 STMicroelectronics Revenue in Fan-in Wafer Level Packaging Business (2014-2019)
12.2.5 STMicroelectronics Recent Development
12.3 TSMC
12.3.1 TSMC Company Details
12.3.2 Company Description and Business Overview
12.3.3 Fan-in Wafer Level Packaging Introduction
12.3.4 TSMC Revenue in Fan-in Wafer Level Packaging Business (2014-2019)
12.3.5 TSMC Recent Development
12.4 Texas Instruments
12.4.1 Texas Instruments Company Details
12.4.2 Company Description and Business Overview
12.4.3 Fan-in Wafer Level Packaging Introduction
12.4.4 Texas Instruments Revenue in Fan-in Wafer Level Packaging Business (2014-2019)
12.4.5 Texas Instruments Recent Development
12.5 Rudolph Technologies
12.5.1 Rudolph Technologies Company Details
12.5.2 Company Description and Business Overview
12.5.3 Fan-in Wafer Level Packaging Introduction
12.5.4 Rudolph Technologies Revenue in Fan-in Wafer Level Packaging Business (2014-2019)
12.5.5 Rudolph Technologies Recent Development
12.6 SEMES
12.6.1 SEMES Company Details
12.6.2 Company Description and Business Overview
12.6.3 Fan-in Wafer Level Packaging Introduction
12.6.4 SEMES Revenue in Fan-in Wafer Level Packaging Business (2014-2019)
12.6.5 SEMES Recent Development
12.7 SUSS MicroTec
12.7.1 SUSS MicroTec Company Details
12.7.2 Company Description and Business Overview
12.7.3 Fan-in Wafer Level Packaging Introduction
12.7.4 SUSS MicroTec Revenue in Fan-in Wafer Level Packaging Business (2014-2019)
12.7.5 SUSS MicroTec Recent Development
12.8 Ultratech
12.8.1 Ultratech Company Details
12.8.2 Company Description and Business Overview
12.8.3 Fan-in Wafer Level Packaging Introduction
12.8.4 Ultratech Revenue in Fan-in Wafer Level Packaging Business (2014-2019)
12.8.5 Ultratech Recent Development
12.9 FlipChip International
12.9.1 FlipChip International Company Details
12.9.2 Company Description and Business Overview
12.9.3 Fan-in Wafer Level Packaging Introduction
12.9.4 FlipChip International Revenue in Fan-in Wafer Level Packaging Business (2014-2019)
12.9.5 FlipChip International Recent Development

13 Market Forecast 2019-2025
13.1 Market Size Forecast by Regions
13.2 United States
13.3 Europe
13.4 China
13.5 Japan
13.6 Southeast Asia
13.7 India
13.8 Central & South America
13.9 Market Size Forecast by Product (2019-2025)
13.10 Market Size Forecast by Application (2019-2025)

14 Analyst's Viewpoints/Conclusions

15 Appendix
15.1 Research Methodology
15.1.1 Methodology/Research Approach
15.1.1.1 Research Programs/Design
15.1.1.2 Market Size Estimation
12.1.1.3 Market Breakdown and Data Triangulation
15.1.2 Data Source
15.1.2.1 Secondary Sources
15.1.2.2 Primary Sources
15.2 Disclaimer
15.3 Author Details