Global IC Advanced Packaging Market Size, Status, Research and Forecast 2019-2025

Published On: Jul 2019

Format: PDF

Publisher: QY Research

Pages: 105

Report ID: 2075

Advanced electronic packages need to address the growing interconnect gap between IC and PCB, achieve a high level of functional integration, and meet form-factor, power, cost, and electrical performance requirements.
The drivers for the IC Packaging Market are the increasing need for advanced architecture in electronic products, rising trend of miniaturization of electronic devices, and growing market for tablets, smartphones, and gaming devices.
In 2018, the global IC Advanced Packaging market size was xx million US$ and it is expected to reach xx million US$ by the end of 2025, with a CAGR of xx% during 2019-2025.

This report focuses on the global IC Advanced Packaging status, future forecast, growth opportunity, key market and key players. The study objectives are to present the IC Advanced Packaging development in United States, Europe and China.

The key players covered in this study
Abel
IBM
Samsung
Toshiba
Intel
Amkor
MAK
Optocap
ASE
Changing Electronics Technology
STMicroelectronics
EKSS Microelectronics

Market segment by Type, the product can be split into
3D
2.5D

Market segment by Application, split into
Logic
Imaging and Optoelectronics
Memory
MEMS/Sensors
LED
Power

Market segment by Regions/Countries, this report covers
United States
Europe
China
Japan
Southeast Asia
India
Central & South America

The study objectives of this report are:
To analyze global IC Advanced Packaging status, future forecast, growth opportunity, key market and key players.
To present the IC Advanced Packaging development in United States, Europe and China.
To strategically profile the key players and comprehensively analyze their development plan and strategies.
To define, describe and forecast the market by product type, market and key regions.

In this study, the years considered to estimate the market size of IC Advanced Packaging are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

Table of Contents

1 Report Overview
1.1 Study Scope
1.2 Key Market Segments
1.3 Players Covered
1.4 Market Analysis by Type
1.4.1 Global IC Advanced Packaging Market Size Growth Rate by Type (2014-2025)
1.4.2 3D
1.4.3 2.5D
1.5 Market by Application
1.5.1 Global IC Advanced Packaging Market Share by Application (2014-2025)
1.5.2 Logic
1.5.3 Imaging and Optoelectronics
1.5.4 Memory
1.5.5 MEMS/Sensors
1.5.6 LED
1.5.7 Power
1.6 Study Objectives
1.7 Years Considered

2 Global Growth Trends
2.1 IC Advanced Packaging Market Size
2.2 IC Advanced Packaging Growth Trends by Regions
2.2.1 IC Advanced Packaging Market Size by Regions (2014-2025)
2.2.2 IC Advanced Packaging Market Share by Regions (2014-2019)
2.3 Industry Trends
2.3.1 Market Top Trends
2.3.2 Market Drivers
2.3.3 Market Opportunities

3 Market Share by Key Players
3.1 IC Advanced Packaging Market Size by Manufacturers
3.1.1 Global IC Advanced Packaging Revenue by Manufacturers (2014-2019)
3.1.2 Global IC Advanced Packaging Revenue Market Share by Manufacturers (2014-2019)
3.1.3 Global IC Advanced Packaging Market Concentration Ratio (CR5 and HHI)
3.2 IC Advanced Packaging Key Players Head office and Area Served
3.3 Key Players IC Advanced Packaging Product/Solution/Service
3.4 Date of Enter into IC Advanced Packaging Market
3.5 Mergers & Acquisitions, Expansion Plans

4 Breakdown Data by Type and Application
4.1 Global IC Advanced Packaging Market Size by Type (2014-2019)
4.2 Global IC Advanced Packaging Market Size by Application (2014-2019)

5 United States
5.1 United States IC Advanced Packaging Market Size (2014-2019)
5.2 IC Advanced Packaging Key Players in United States
5.3 United States IC Advanced Packaging Market Size by Type
5.4 United States IC Advanced Packaging Market Size by Application

6 Europe
6.1 Europe IC Advanced Packaging Market Size (2014-2019)
6.2 IC Advanced Packaging Key Players in Europe
6.3 Europe IC Advanced Packaging Market Size by Type
6.4 Europe IC Advanced Packaging Market Size by Application

7 China
7.1 China IC Advanced Packaging Market Size (2014-2019)
7.2 IC Advanced Packaging Key Players in China
7.3 China IC Advanced Packaging Market Size by Type
7.4 China IC Advanced Packaging Market Size by Application

8 Japan
8.1 Japan IC Advanced Packaging Market Size (2014-2019)
8.2 IC Advanced Packaging Key Players in Japan
8.3 Japan IC Advanced Packaging Market Size by Type
8.4 Japan IC Advanced Packaging Market Size by Application

9 Southeast Asia
9.1 Southeast Asia IC Advanced Packaging Market Size (2014-2019)
9.2 IC Advanced Packaging Key Players in Southeast Asia
9.3 Southeast Asia IC Advanced Packaging Market Size by Type
9.4 Southeast Asia IC Advanced Packaging Market Size by Application

10 India
10.1 India IC Advanced Packaging Market Size (2014-2019)
10.2 IC Advanced Packaging Key Players in India
10.3 India IC Advanced Packaging Market Size by Type
10.4 India IC Advanced Packaging Market Size by Application

11 Central & South America
11.1 Central & South America IC Advanced Packaging Market Size (2014-2019)
11.2 IC Advanced Packaging Key Players in Central & South America
11.3 Central & South America IC Advanced Packaging Market Size by Type
11.4 Central & South America IC Advanced Packaging Market Size by Application

12 International Players Profiles
12.1 Abel
12.1.1 Abel Company Details
12.1.2 Company Description and Business Overview
12.1.3 IC Advanced Packaging Introduction
12.1.4 Abel Revenue in IC Advanced Packaging Business (2014-2019)
12.1.5 Abel Recent Development
12.2 IBM
12.2.1 IBM Company Details
12.2.2 Company Description and Business Overview
12.2.3 IC Advanced Packaging Introduction
12.2.4 IBM Revenue in IC Advanced Packaging Business (2014-2019)
12.2.5 IBM Recent Development
12.3 Samsung
12.3.1 Samsung Company Details
12.3.2 Company Description and Business Overview
12.3.3 IC Advanced Packaging Introduction
12.3.4 Samsung Revenue in IC Advanced Packaging Business (2014-2019)
12.3.5 Samsung Recent Development
12.4 Toshiba
12.4.1 Toshiba Company Details
12.4.2 Company Description and Business Overview
12.4.3 IC Advanced Packaging Introduction
12.4.4 Toshiba Revenue in IC Advanced Packaging Business (2014-2019)
12.4.5 Toshiba Recent Development
12.5 Intel
12.5.1 Intel Company Details
12.5.2 Company Description and Business Overview
12.5.3 IC Advanced Packaging Introduction
12.5.4 Intel Revenue in IC Advanced Packaging Business (2014-2019)
12.5.5 Intel Recent Development
12.6 Amkor
12.6.1 Amkor Company Details
12.6.2 Company Description and Business Overview
12.6.3 IC Advanced Packaging Introduction
12.6.4 Amkor Revenue in IC Advanced Packaging Business (2014-2019)
12.6.5 Amkor Recent Development
12.7 MAK
12.7.1 MAK Company Details
12.7.2 Company Description and Business Overview
12.7.3 IC Advanced Packaging Introduction
12.7.4 MAK Revenue in IC Advanced Packaging Business (2014-2019)
12.7.5 MAK Recent Development
12.8 Optocap
12.8.1 Optocap Company Details
12.8.2 Company Description and Business Overview
12.8.3 IC Advanced Packaging Introduction
12.8.4 Optocap Revenue in IC Advanced Packaging Business (2014-2019)
12.8.5 Optocap Recent Development
12.9 ASE
12.9.1 ASE Company Details
12.9.2 Company Description and Business Overview
12.9.3 IC Advanced Packaging Introduction
12.9.4 ASE Revenue in IC Advanced Packaging Business (2014-2019)
12.9.5 ASE Recent Development
12.10 Changing Electronics Technology
12.10.1 Changing Electronics Technology Company Details
12.10.2 Company Description and Business Overview
12.10.3 IC Advanced Packaging Introduction
12.10.4 Changing Electronics Technology Revenue in IC Advanced Packaging Business (2014-2019)
12.10.5 Changing Electronics Technology Recent Development
12.11 STMicroelectronics
12.12 EKSS Microelectronics

13 Market Forecast 2019-2025
13.1 Market Size Forecast by Regions
13.2 United States
13.3 Europe
13.4 China
13.5 Japan
13.6 Southeast Asia
13.7 India
13.8 Central & South America
13.9 Market Size Forecast by Product (2019-2025)
13.10 Market Size Forecast by Application (2019-2025)

14 Analyst's Viewpoints/Conclusions

15 Appendix
15.1 Research Methodology
15.1.1 Methodology/Research Approach
15.1.1.1 Research Programs/Design
15.1.1.2 Market Size Estimation
12.1.1.3 Market Breakdown and Data Triangulation
15.1.2 Data Source
15.1.2.1 Secondary Sources
15.1.2.2 Primary Sources
15.2 Disclaimer
15.3 Author Details