Global Semiconductor Assembly and Packaging Services Market Size, Status and Forecast 2019-2025

Published On: Jun 2019

Format: PDF

Publisher: QY Research

Pages: 91

Report ID: 2044

Semiconductor assembly and packaging services are crucial in the semiconductor production process. The package of the semiconductor device is usually made of materials such as plastic, metal, and ceramic/glass. Packaging is undertaken to provide protection against impact and corrosion.
The communication sector accounted for the largest share of the semiconductor assembly and packaging services market during 2017. According to Technavio’s market research analysts, this segment is likely to continue its dominance in the wafer fabrication market throughout the forecast period.
APAC accounted for the largest share of the semiconductor assembly and packaging services market during 2017. According to research analysts, this regional segment is likely to continue its dominance in the wafer fabrication market throughout the forecast period.
In 2018, the global Semiconductor Assembly and Packaging Services market size was xx million US$ and it is expected to reach xx million US$ by the end of 2025, with a CAGR of xx% during 2019-2025.

This report focuses on the global Semiconductor Assembly and Packaging Services status, future forecast, growth opportunity, key market and key players. The study objectives are to present the Semiconductor Assembly and Packaging Services development in United States, Europe and China.

The key players covered in this study
Advanced Semiconductor Engineering (ASE)
Amkor Technology
Intel
Samsung Electronics
SPIL
TSMC
...

Market segment by Type, the product can be split into
Assembly Services
Packaging Services

Market segment by Application, split into
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other

Market segment by Regions/Countries, this report covers
United States
Europe
China
Japan
Southeast Asia
India
Central & South America

The study objectives of this report are:
To analyze global Semiconductor Assembly and Packaging Services status, future forecast, growth opportunity, key market and key players.
To present the Semiconductor Assembly and Packaging Services development in United States, Europe and China.
To strategically profile the key players and comprehensively analyze their development plan and strategies.
To define, describe and forecast the market by product type, market and key regions.

In this study, the years considered to estimate the market size of Semiconductor Assembly and Packaging Services are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

Table of Contents

1 Report Overview
1.1 Study Scope
1.2 Key Market Segments
1.3 Players Covered
1.4 Market Analysis by Type
1.4.1 Global Semiconductor Assembly and Packaging Services Market Size Growth Rate by Type (2014-2025)
1.4.2 Assembly Services
1.4.3 Packaging Services
1.5 Market by Application
1.5.1 Global Semiconductor Assembly and Packaging Services Market Share by Application (2014-2025)
1.5.2 Telecommunications
1.5.3 Automotive
1.5.4 Aerospace and Defense
1.5.5 Medical Devices
1.5.6 Consumer Electronics
1.5.7 Other
1.6 Study Objectives
1.7 Years Considered

2 Global Growth Trends
2.1 Semiconductor Assembly and Packaging Services Market Size
2.2 Semiconductor Assembly and Packaging Services Growth Trends by Regions
2.2.1 Semiconductor Assembly and Packaging Services Market Size by Regions (2014-2025)
2.2.2 Semiconductor Assembly and Packaging Services Market Share by Regions (2014-2019)
2.3 Industry Trends
2.3.1 Market Top Trends
2.3.2 Market Drivers
2.3.3 Market Opportunities

3 Market Share by Key Players
3.1 Semiconductor Assembly and Packaging Services Market Size by Manufacturers
3.1.1 Global Semiconductor Assembly and Packaging Services Revenue by Manufacturers (2014-2019)
3.1.2 Global Semiconductor Assembly and Packaging Services Revenue Market Share by Manufacturers (2014-2019)
3.1.3 Global Semiconductor Assembly and Packaging Services Market Concentration Ratio (CR5 and HHI)
3.2 Semiconductor Assembly and Packaging Services Key Players Head office and Area Served
3.3 Key Players Semiconductor Assembly and Packaging Services Product/Solution/Service
3.4 Date of Enter into Semiconductor Assembly and Packaging Services Market
3.5 Mergers & Acquisitions, Expansion Plans

4 Breakdown Data by Type and Application
4.1 Global Semiconductor Assembly and Packaging Services Market Size by Type (2014-2019)
4.2 Global Semiconductor Assembly and Packaging Services Market Size by Application (2014-2019)

5 United States
5.1 United States Semiconductor Assembly and Packaging Services Market Size (2014-2019)
5.2 Semiconductor Assembly and Packaging Services Key Players in United States
5.3 United States Semiconductor Assembly and Packaging Services Market Size by Type
5.4 United States Semiconductor Assembly and Packaging Services Market Size by Application

6 Europe
6.1 Europe Semiconductor Assembly and Packaging Services Market Size (2014-2019)
6.2 Semiconductor Assembly and Packaging Services Key Players in Europe
6.3 Europe Semiconductor Assembly and Packaging Services Market Size by Type
6.4 Europe Semiconductor Assembly and Packaging Services Market Size by Application

7 China
7.1 China Semiconductor Assembly and Packaging Services Market Size (2014-2019)
7.2 Semiconductor Assembly and Packaging Services Key Players in China
7.3 China Semiconductor Assembly and Packaging Services Market Size by Type
7.4 China Semiconductor Assembly and Packaging Services Market Size by Application

8 Japan
8.1 Japan Semiconductor Assembly and Packaging Services Market Size (2014-2019)
8.2 Semiconductor Assembly and Packaging Services Key Players in Japan
8.3 Japan Semiconductor Assembly and Packaging Services Market Size by Type
8.4 Japan Semiconductor Assembly and Packaging Services Market Size by Application

9 Southeast Asia
9.1 Southeast Asia Semiconductor Assembly and Packaging Services Market Size (2014-2019)
9.2 Semiconductor Assembly and Packaging Services Key Players in Southeast Asia
9.3 Southeast Asia Semiconductor Assembly and Packaging Services Market Size by Type
9.4 Southeast Asia Semiconductor Assembly and Packaging Services Market Size by Application

10 India
10.1 India Semiconductor Assembly and Packaging Services Market Size (2014-2019)
10.2 Semiconductor Assembly and Packaging Services Key Players in India
10.3 India Semiconductor Assembly and Packaging Services Market Size by Type
10.4 India Semiconductor Assembly and Packaging Services Market Size by Application

11 Central & South America
11.1 Central & South America Semiconductor Assembly and Packaging Services Market Size (2014-2019)
11.2 Semiconductor Assembly and Packaging Services Key Players in Central & South America
11.3 Central & South America Semiconductor Assembly and Packaging Services Market Size by Type
11.4 Central & South America Semiconductor Assembly and Packaging Services Market Size by Application

12 International Players Profiles
12.1 Advanced Semiconductor Engineering (ASE)
12.1.1 Advanced Semiconductor Engineering (ASE) Company Details
12.1.2 Company Description and Business Overview
12.1.3 Semiconductor Assembly and Packaging Services Introduction
12.1.4 Advanced Semiconductor Engineering (ASE) Revenue in Semiconductor Assembly and Packaging Services Business (2014-2019)
12.1.5 Advanced Semiconductor Engineering (ASE) Recent Development
12.2 Amkor Technology
12.2.1 Amkor Technology Company Details
12.2.2 Company Description and Business Overview
12.2.3 Semiconductor Assembly and Packaging Services Introduction
12.2.4 Amkor Technology Revenue in Semiconductor Assembly and Packaging Services Business (2014-2019)
12.2.5 Amkor Technology Recent Development
12.3 Intel
12.3.1 Intel Company Details
12.3.2 Company Description and Business Overview
12.3.3 Semiconductor Assembly and Packaging Services Introduction
12.3.4 Intel Revenue in Semiconductor Assembly and Packaging Services Business (2014-2019)
12.3.5 Intel Recent Development
12.4 Samsung Electronics
12.4.1 Samsung Electronics Company Details
12.4.2 Company Description and Business Overview
12.4.3 Semiconductor Assembly and Packaging Services Introduction
12.4.4 Samsung Electronics Revenue in Semiconductor Assembly and Packaging Services Business (2014-2019)
12.4.5 Samsung Electronics Recent Development
12.5 SPIL
12.5.1 SPIL Company Details
12.5.2 Company Description and Business Overview
12.5.3 Semiconductor Assembly and Packaging Services Introduction
12.5.4 SPIL Revenue in Semiconductor Assembly and Packaging Services Business (2014-2019)
12.5.5 SPIL Recent Development
12.6 TSMC
12.6.1 TSMC Company Details
12.6.2 Company Description and Business Overview
12.6.3 Semiconductor Assembly and Packaging Services Introduction
12.6.4 TSMC Revenue in Semiconductor Assembly and Packaging Services Business (2014-2019)
12.6.5 TSMC Recent Development

13 Market Forecast 2019-2025
13.1 Market Size Forecast by Regions
13.2 United States
13.3 Europe
13.4 China
13.5 Japan
13.6 Southeast Asia
13.7 India
13.8 Central & South America
13.9 Market Size Forecast by Product (2019-2025)
13.10 Market Size Forecast by Application (2019-2025)

14 Analyst's Viewpoints/Conclusions

15 Appendix
15.1 Research Methodology
15.1.1 Methodology/Research Approach
15.1.1.1 Research Programs/Design
15.1.1.2 Market Size Estimation
12.1.1.3 Market Breakdown and Data Triangulation
15.1.2 Data Source
15.1.2.1 Secondary Sources
15.1.2.2 Primary Sources
15.2 Disclaimer
15.3 Author Details