Global Semiconductor Packaging Equipments Market Research Report 2019-2025

Published On: Jul 2019

Format: PDF

Publisher: QY Research

Pages: 106

Report ID: 4408

Semiconductor packaging is carried out to provide extra protection to wafers or substrates. The package casing is made up of materials such as metal, plastic, glass, or ceramic and contains one or more semiconductor electronic components.
Accounting for more than 55% of the total market shares, the die-level packaging equipment segment dominated the market. This growth can be attributed to the increasing demand for application processors, basebands, and SoCs, which are integrated into mobile and consumer electronic devices. Though the market shares of this segment will decline due to the use of advanced technologies, this segment will continue to dominate the market throughout the forecast period.
According to this market study, the OSATs will account for more than 58% of the total market shares and will also dominate the semiconductor packaging equipment market throughout the predicted period. The migration of a number of semiconductor manufacturers to the fabless model is identified to be the major factor for the growth of the market segment. Additionally, the development of new technologies such as FOWLP, 2.5D, and TSV has also increased the outsourcing of back-end processes, which will also fuel the growth of this market segment.

The global Semiconductor Packaging Equipments market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Semiconductor Packaging Equipments volume and value at global level, regional level and company level. From a global perspective, this report represents overall Semiconductor Packaging Equipments market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.
At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.

The following manufacturers are covered:
Applied Materials
ASM Pacific Technology
Kulicke and Soffa Industries
Tokyo Electron Limited
Tokyo Seimitsu
ChipMos
Greatek
Hua Hong
Jiangsu Changjiang Electronics Technology
Lingsen Precision
Nepes
Tianshui Huatian
Unisem
Ultratech

Segment by Regions
North America
Europe
China
Japan

Segment by Type
Die-Level Packaging Equipment
Wafer-Level Packaging Equipment

Segment by Application
IDM (Integrated Device Manufacturers)
OSAT (Outsourced Semiconductor Assembly and Test Companies)

Table of Contents

Executive Summary
1 Semiconductor Packaging Equipments Market Overview
1.1 Product Overview and Scope of Semiconductor Packaging Equipments
1.2 Semiconductor Packaging Equipments Segment by Type
1.2.1 Global Semiconductor Packaging Equipments Production Growth Rate Comparison by Type (2014-2025)
1.2.2 Die-Level Packaging Equipment
1.2.3 Wafer-Level Packaging Equipment
1.3 Semiconductor Packaging Equipments Segment by Application
1.3.1 Semiconductor Packaging Equipments Consumption Comparison by Application (2014-2025)
1.3.2 IDM (Integrated Device Manufacturers)
1.3.3 OSAT (Outsourced Semiconductor Assembly and Test Companies)
1.4 Global Semiconductor Packaging Equipments Market by Region
1.4.1 Global Semiconductor Packaging Equipments Market Size Region
1.4.2 North America Status and Prospect (2014-2025)
1.4.3 Europe Status and Prospect (2014-2025)
1.4.4 China Status and Prospect (2014-2025)
1.4.5 Japan Status and Prospect (2014-2025)
1.5 Global Semiconductor Packaging Equipments Market Size
1.5.1 Global Semiconductor Packaging Equipments Revenue (2014-2025)
1.5.2 Global Semiconductor Packaging Equipments Production (2014-2025)

2 Global Semiconductor Packaging Equipments Market Competition by Manufacturers
2.1 Global Semiconductor Packaging Equipments Production Market Share by Manufacturers (2014-2019)
2.2 Global Semiconductor Packaging Equipments Revenue Share by Manufacturers (2014-2019)
2.3 Global Semiconductor Packaging Equipments Average Price by Manufacturers (2014-2019)
2.4 Manufacturers Semiconductor Packaging Equipments Production Sites, Area Served, Product Types
2.5 Semiconductor Packaging Equipments Market Competitive Situation and Trends
2.5.1 Semiconductor Packaging Equipments Market Concentration Rate
2.5.2 Semiconductor Packaging Equipments Market Share of Top 3 and Top 5 Manufacturers
2.5.3 Mergers & Acquisitions, Expansion

3 Global Semiconductor Packaging Equipments Production Market Share by Regions
3.1 Global Semiconductor Packaging Equipments Production Market Share by Regions
3.2 Global Semiconductor Packaging Equipments Revenue Market Share by Regions (2014-2019)
3.3 Global Semiconductor Packaging Equipments Production, Revenue, Price and Gross Margin (2014-2019)
3.4 North America Semiconductor Packaging Equipments Production
3.4.1 North America Semiconductor Packaging Equipments Production Growth Rate (2014-2019)
3.4.2 North America Semiconductor Packaging Equipments Production, Revenue, Price and Gross Margin (2014-2019)
3.5 Europe Semiconductor Packaging Equipments Production
3.5.1 Europe Semiconductor Packaging Equipments Production Growth Rate (2014-2019)
3.5.2 Europe Semiconductor Packaging Equipments Production, Revenue, Price and Gross Margin (2014-2019)
3.6 China Semiconductor Packaging Equipments Production (2014-2019)
3.6.1 China Semiconductor Packaging Equipments Production Growth Rate (2014-2019)
3.6.2 China Semiconductor Packaging Equipments Production, Revenue, Price and Gross Margin (2014-2019)
3.7 Japan Semiconductor Packaging Equipments Production (2014-2019)
3.7.1 Japan Semiconductor Packaging Equipments Production Growth Rate (2014-2019)
3.7.2 Japan Semiconductor Packaging Equipments Production, Revenue, Price and Gross Margin (2014-2019)

4 Global Semiconductor Packaging Equipments Consumption by Regions
4.1 Global Semiconductor Packaging Equipments Consumption by Regions
4.2 North America Semiconductor Packaging Equipments Consumption (2014-2019)
4.3 Europe Semiconductor Packaging Equipments Consumption (2014-2019)
4.4 China Semiconductor Packaging Equipments Consumption (2014-2019)
4.5 Japan Semiconductor Packaging Equipments Consumption (2014-2019)

5 Global Semiconductor Packaging Equipments Production, Revenue, Price Trend by Type
5.1 Global Semiconductor Packaging Equipments Production Market Share by Type (2014-2019)
5.2 Global Semiconductor Packaging Equipments Revenue Market Share by Type (2014-2019)
5.3 Global Semiconductor Packaging Equipments Price by Type (2014-2019)
5.4 Global Semiconductor Packaging Equipments Production Growth by Type (2014-2019)

6 Global Semiconductor Packaging Equipments Market Analysis by Applications
6.1 Global Semiconductor Packaging Equipments Consumption Market Share by Application (2014-2019)
6.2 Global Semiconductor Packaging Equipments Consumption Growth Rate by Application (2014-2019)

7 Company Profiles and Key Figures in Semiconductor Packaging Equipments Business
7.1 Applied Materials
7.1.1 Applied Materials Semiconductor Packaging Equipments Production Sites and Area Served
7.1.2 Semiconductor Packaging Equipments Product Introduction, Application and Specification
7.1.3 Applied Materials Semiconductor Packaging Equipments Production, Revenue, Price and Gross Margin (2014-2019)
7.1.4 Main Business and Markets Served
7.2 ASM Pacific Technology
7.2.1 ASM Pacific Technology Semiconductor Packaging Equipments Production Sites and Area Served
7.2.2 Semiconductor Packaging Equipments Product Introduction, Application and Specification
7.2.3 ASM Pacific Technology Semiconductor Packaging Equipments Production, Revenue, Price and Gross Margin (2014-2019)
7.2.4 Main Business and Markets Served
7.3 Kulicke and Soffa Industries
7.3.1 Kulicke and Soffa Industries Semiconductor Packaging Equipments Production Sites and Area Served
7.3.2 Semiconductor Packaging Equipments Product Introduction, Application and Specification
7.3.3 Kulicke and Soffa Industries Semiconductor Packaging Equipments Production, Revenue, Price and Gross Margin (2014-2019)
7.3.4 Main Business and Markets Served
7.4 Tokyo Electron Limited
7.4.1 Tokyo Electron Limited Semiconductor Packaging Equipments Production Sites and Area Served
7.4.2 Semiconductor Packaging Equipments Product Introduction, Application and Specification
7.4.3 Tokyo Electron Limited Semiconductor Packaging Equipments Production, Revenue, Price and Gross Margin (2014-2019)
7.4.4 Main Business and Markets Served
7.5 Tokyo Seimitsu
7.5.1 Tokyo Seimitsu Semiconductor Packaging Equipments Production Sites and Area Served
7.5.2 Semiconductor Packaging Equipments Product Introduction, Application and Specification
7.5.3 Tokyo Seimitsu Semiconductor Packaging Equipments Production, Revenue, Price and Gross Margin (2014-2019)
7.5.4 Main Business and Markets Served
7.6 ChipMos
7.6.1 ChipMos Semiconductor Packaging Equipments Production Sites and Area Served
7.6.2 Semiconductor Packaging Equipments Product Introduction, Application and Specification
7.6.3 ChipMos Semiconductor Packaging Equipments Production, Revenue, Price and Gross Margin (2014-2019)
7.6.4 Main Business and Markets Served
7.7 Greatek
7.7.1 Greatek Semiconductor Packaging Equipments Production Sites and Area Served
7.7.2 Semiconductor Packaging Equipments Product Introduction, Application and Specification
7.7.3 Greatek Semiconductor Packaging Equipments Production, Revenue, Price and Gross Margin (2014-2019)
7.7.4 Main Business and Markets Served
7.8 Hua Hong
7.8.1 Hua Hong Semiconductor Packaging Equipments Production Sites and Area Served
7.8.2 Semiconductor Packaging Equipments Product Introduction, Application and Specification
7.8.3 Hua Hong Semiconductor Packaging Equipments Production, Revenue, Price and Gross Margin (2014-2019)
7.8.4 Main Business and Markets Served
7.9 Jiangsu Changjiang Electronics Technology
7.9.1 Jiangsu Changjiang Electronics Technology Semiconductor Packaging Equipments Production Sites and Area Served
7.9.2 Semiconductor Packaging Equipments Product Introduction, Application and Specification
7.9.3 Jiangsu Changjiang Electronics Technology Semiconductor Packaging Equipments Production, Revenue, Price and Gross Margin (2014-2019)
7.9.4 Main Business and Markets Served
7.10 Lingsen Precision
7.10.1 Lingsen Precision Semiconductor Packaging Equipments Production Sites and Area Served
7.10.2 Semiconductor Packaging Equipments Product Introduction, Application and Specification
7.10.3 Lingsen Precision Semiconductor Packaging Equipments Production, Revenue, Price and Gross Margin (2014-2019)
7.10.4 Main Business and Markets Served
7.11 Nepes
7.12 Tianshui Huatian
7.13 Unisem
7.14 Ultratech

8 Semiconductor Packaging Equipments Manufacturing Cost Analysis
8.1 Semiconductor Packaging Equipments Key Raw Materials Analysis
8.1.1 Key Raw Materials
8.1.2 Price Trend of Key Raw Materials
8.1.3 Key Suppliers of Raw Materials
8.2 Proportion of Manufacturing Cost Structure
8.3 Manufacturing Process Analysis of Semiconductor Packaging Equipments
8.4 Semiconductor Packaging Equipments Industrial Chain Analysis

9 Marketing Channel, Distributors and Customers
9.1 Marketing Channel
9.1.1 Direct Marketing
9.1.2 Indirect Marketing
9.2 Semiconductor Packaging Equipments Distributors List
9.3 Semiconductor Packaging Equipments Customers

10 Market Dynamics
10.1 Market Trends
10.2 Opportunities
10.3 Market Drivers
10.4 Challenges
10.5 Influence Factors

11 Global Semiconductor Packaging Equipments Market Forecast
11.1 Global Semiconductor Packaging Equipments Production, Revenue Forecast
11.1.1 Global Semiconductor Packaging Equipments Production Growth Rate Forecast (2019-2025)
11.1.2 Global Semiconductor Packaging Equipments Revenue and Growth Rate Forecast (2019-2025)
11.1.3 Global Semiconductor Packaging Equipments Price and Trend Forecast (2019-2025)
11.2 Global Semiconductor Packaging Equipments Production Forecast by Regions (2019-2025)
11.2.1 North America Semiconductor Packaging Equipments Production, Revenue Forecast (2019-2025)
11.2.2 Europe Semiconductor Packaging Equipments Production, Revenue Forecast (2019-2025)
11.2.3 China Semiconductor Packaging Equipments Production, Revenue Forecast (2019-2025)
11.2.4 Japan Semiconductor Packaging Equipments Production, Revenue Forecast (2019-2025)
11.3 Global Semiconductor Packaging Equipments Consumption Forecast by Regions (2019-2025)
11.3.1 North America Semiconductor Packaging Equipments Consumption Forecast (2019-2025)
11.3.2 Europe Semiconductor Packaging Equipments Consumption Forecast (2019-2025)
11.3.3 China Semiconductor Packaging Equipments Consumption Forecast (2019-2025)
11.3.4 Japan Semiconductor Packaging Equipments Consumption Forecast (2019-2025)
11.4 Global Semiconductor Packaging Equipments Production, Revenue and Price Forecast by Type (2019-2025)
11.5 Global Semiconductor Packaging Equipments Consumption Forecast by Application (2019-2025)

12 Research Findings and Conclusion

13 Methodology and Data Source
13.1 Methodology/Research Approach
13.1.1 Research Programs/Design
13.1.2 Market Size Estimation
13.1.3 Market Breakdown and Data Triangulation
13.2 Data Source
13.2.1 Secondary Sources
13.2.2 Primary Sources
13.3 Author List
13.4 Disclaimer