Global System-in-Package Market Size, Status and Forecast 2019-2025

Published On: Jun 2019

Format: PDF

Publisher: QY Research

Pages: 90

Report ID: 1449

SiP is a packaging technology, which contains multiple die in a single module. It is a mixture of various integrated circuits in a compact size, which further reduces the cost to develop and assemble a printed circuit board (PCB). SiP dies can be stacked vertically or tiled horizontally with standard off-chip wire bonds or solder bumps.
The emergence of advanced and compact consumer electronic devices as one of the primary growth factors for this semiconductor packaging market. The consumer electronics devices industry has witnessed a massive transformation in the recent years, where feature phones were replaced by smartphones and personal computers by laptops and tablets. Furthermore, the adoption of the smart homes concept, where electronic devices can be monitored and controlled with the help of mobile applications, will further transition this industry. This will induce electronic device manufacturers to constantly upgrade their products in terms of several factors such as design, processing power, power consumption, and user-interface, that will require the use of robust technology and develop compact devices. This demand for compact electronic devices will compel semiconductor manufacturers to develop denser ICs with increased circuitry, which will boost the demand for advanced IC packagingtechniques such as SiP.
In 2018, the global System-in-Package market size was 5220 million US$ and it is expected to reach 10900 million US$ by the end of 2025, with a CAGR of 9.6% during 2019-2025.

This report focuses on the global System-in-Package status, future forecast, growth opportunity, key market and key players. The study objectives are to present the System-in-Package development in United States, Europe and China.

The key players covered in this study
Amkor Technology
ASE
Jiangsu Changjiang Electronics Technology (JCET)
Siliconware Precision Industries (SPIL)
United Test and Assembly Center (UTAC)
...

Market segment by Type, the product can be split into
2D IC
2.5D IC
3D IC

Market segment by Application, split into
Consumer Electronics
Communications
Automotive & Transportation
Aerospace & Defense
Healthcare
Others

Market segment by Regions/Countries, this report covers
United States
Europe
China
Japan
Southeast Asia
India
Central & South America

The study objectives of this report are:
To analyze global System-in-Package status, future forecast, growth opportunity, key market and key players.
To present the System-in-Package development in United States, Europe and China.
To strategically profile the key players and comprehensively analyze their development plan and strategies.
To define, describe and forecast the market by product type, market and key regions.

In this study, the years considered to estimate the market size of System-in-Package are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

Table of Contents

1 Report Overview
1.1 Study Scope
1.2 Key Market Segments
1.3 Players Covered
1.4 Market Analysis by Type
1.4.1 Global System-in-Package Market Size Growth Rate by Type (2014-2025)
1.4.2 2D IC
1.4.3 2.5D IC
1.4.4 3D IC
1.5 Market by Application
1.5.1 Global System-in-Package Market Share by Application (2014-2025)
1.5.2 Consumer Electronics
1.5.3 Communications
1.5.4 Automotive & Transportation
1.5.5 Aerospace & Defense
1.5.6 Healthcare
1.5.7 Others
1.6 Study Objectives
1.7 Years Considered

2 Global Growth Trends
2.1 System-in-Package Market Size
2.2 System-in-Package Growth Trends by Regions
2.2.1 System-in-Package Market Size by Regions (2014-2025)
2.2.2 System-in-Package Market Share by Regions (2014-2019)
2.3 Industry Trends
2.3.1 Market Top Trends
2.3.2 Market Drivers
2.3.3 Market Opportunities

3 Market Share by Key Players
3.1 System-in-Package Market Size by Manufacturers
3.1.1 Global System-in-Package Revenue by Manufacturers (2014-2019)
3.1.2 Global System-in-Package Revenue Market Share by Manufacturers (2014-2019)
3.1.3 Global System-in-Package Market Concentration Ratio (CR5 and HHI)
3.2 System-in-Package Key Players Head office and Area Served
3.3 Key Players System-in-Package Product/Solution/Service
3.4 Date of Enter into System-in-Package Market
3.5 Mergers & Acquisitions, Expansion Plans

4 Breakdown Data by Type and Application
4.1 Global System-in-Package Market Size by Type (2014-2019)
4.2 Global System-in-Package Market Size by Application (2014-2019)

5 United States
5.1 United States System-in-Package Market Size (2014-2019)
5.2 System-in-Package Key Players in United States
5.3 United States System-in-Package Market Size by Type
5.4 United States System-in-Package Market Size by Application

6 Europe
6.1 Europe System-in-Package Market Size (2014-2019)
6.2 System-in-Package Key Players in Europe
6.3 Europe System-in-Package Market Size by Type
6.4 Europe System-in-Package Market Size by Application

7 China
7.1 China System-in-Package Market Size (2014-2019)
7.2 System-in-Package Key Players in China
7.3 China System-in-Package Market Size by Type
7.4 China System-in-Package Market Size by Application

8 Japan
8.1 Japan System-in-Package Market Size (2014-2019)
8.2 System-in-Package Key Players in Japan
8.3 Japan System-in-Package Market Size by Type
8.4 Japan System-in-Package Market Size by Application

9 Southeast Asia
9.1 Southeast Asia System-in-Package Market Size (2014-2019)
9.2 System-in-Package Key Players in Southeast Asia
9.3 Southeast Asia System-in-Package Market Size by Type
9.4 Southeast Asia System-in-Package Market Size by Application

10 India
10.1 India System-in-Package Market Size (2014-2019)
10.2 System-in-Package Key Players in India
10.3 India System-in-Package Market Size by Type
10.4 India System-in-Package Market Size by Application

11 Central & South America
11.1 Central & South America System-in-Package Market Size (2014-2019)
11.2 System-in-Package Key Players in Central & South America
11.3 Central & South America System-in-Package Market Size by Type
11.4 Central & South America System-in-Package Market Size by Application

12 International Players Profiles
12.1 Amkor Technology
12.1.1 Amkor Technology Company Details
12.1.2 Company Description and Business Overview
12.1.3 System-in-Package Introduction
12.1.4 Amkor Technology Revenue in System-in-Package Business (2014-2019)
12.1.5 Amkor Technology Recent Development
12.2 ASE
12.2.1 ASE Company Details
12.2.2 Company Description and Business Overview
12.2.3 System-in-Package Introduction
12.2.4 ASE Revenue in System-in-Package Business (2014-2019)
12.2.5 ASE Recent Development
12.3 Jiangsu Changjiang Electronics Technology (JCET)
12.3.1 Jiangsu Changjiang Electronics Technology (JCET) Company Details
12.3.2 Company Description and Business Overview
12.3.3 System-in-Package Introduction
12.3.4 Jiangsu Changjiang Electronics Technology (JCET) Revenue in System-in-Package Business (2014-2019)
12.3.5 Jiangsu Changjiang Electronics Technology (JCET) Recent Development
12.4 Siliconware Precision Industries (SPIL)
12.4.1 Siliconware Precision Industries (SPIL) Company Details
12.4.2 Company Description and Business Overview
12.4.3 System-in-Package Introduction
12.4.4 Siliconware Precision Industries (SPIL) Revenue in System-in-Package Business (2014-2019)
12.4.5 Siliconware Precision Industries (SPIL) Recent Development
12.5 United Test and Assembly Center (UTAC)
12.5.1 United Test and Assembly Center (UTAC) Company Details
12.5.2 Company Description and Business Overview
12.5.3 System-in-Package Introduction
12.5.4 United Test and Assembly Center (UTAC) Revenue in System-in-Package Business (2014-2019)
12.5.5 United Test and Assembly Center (UTAC) Recent Development

13 Market Forecast 2019-2025
13.1 Market Size Forecast by Regions
13.2 United States
13.3 Europe
13.4 China
13.5 Japan
13.6 Southeast Asia
13.7 India
13.8 Central & South America
13.9 Market Size Forecast by Product (2019-2025)
13.10 Market Size Forecast by Application (2019-2025)

14 Analyst's Viewpoints/Conclusions

15 Appendix
15.1 Research Methodology
15.1.1 Methodology/Research Approach
15.1.1.1 Research Programs/Design
15.1.1.2 Market Size Estimation
12.1.1.3 Market Breakdown and Data Triangulation
15.1.2 Data Source
15.1.2.1 Secondary Sources
15.1.2.2 Primary Sources
15.2 Disclaimer
15.3 Author Details